Contents

Table of Contents
List of Abbreviations
Labels and Symbols
Important Information Please Read Before Use
- Intended Use
- Instruction Manual
- Instrument Compatibility
- Repair and Modification
- Safety Symbols
- Safety Signal Words
- Note Signal Words
- Safety
- Warnings
- Battery Precautions
- Hearing Protection
- Equipment Disposal
- CE (European Community)
- WEEE Directive
- EMC Directive Compliance
- Warranty Information
- Technical Support
Introduction
1. Overview
- 1.1 Equipment Required for Bond Testing
- 1.2 Component Connections
- 1.3 Operating Environment
2. Component Setup
- 2.1 Installing the Bond Testing Components
- 2.2 Connecting the Probe and Adaptor
3. Software Features and Setup
- 3.1 C-Scans and Normalization
- 3.2 Starting Up the MXB Software
- 3.3 Creating a Setup
  - 3.3.1 Setting the Instrument to Inspection Mode
  - 3.3.2 Using the Wizard to Create a Setup
4. Probe Calibration
- 4.1 Balancing a Probe
- 4.2 Normalizing the Probe Channels
5. Inspection
- 5.1 Performing an Inspection
- 5.2 Analyzing Data
- 5.3 Changing the Color Palette
Appendix A: Bond-Testing Scanner Setup
- A.1 Configuring the WING or GLIDER Scanner Parameters
- A.2 Configuring the Handheld Scanner Parameters
- A.3 Defining the Scan Area for Any Type of Scanner
Appendix B: Handheld Scanner Specifications and Maintenance
- B.1 Probe Interface Connector
- B.2 Encoder Connector
- B.3 Maintenance
  - B.3.1 Preventive Maintenance
  - B.3.2 Unit Cleaning
List of Figures
List of Tables
Index
- A
- B
- C
- D
- E
- F
- G
- H
- I
- L
- M
- N
- O
- P
- R
- S
- T
- U
- W

Olympus OmniScan Bond Basic Operation Manual

Pages 70

Year 2015

Language(s)

of 70

Olympus OmniScan Bond Specification

The Olympus OmniScan Bond is a sophisticated non-destructive testing (NDT) instrument designed for advanced bond testing applications. It features a compact and rugged design, making it suitable for field use in various industrial environments. The device is built around a high-resolution color touchscreen interface, allowing intuitive navigation and operation, essential for fast-paced inspection tasks.

The OmniScan Bond integrates advanced ultrasonic technology to deliver precise measurements and analyses. Its capabilities include multiple modes of operation such as pitch-catch, resonance, and through transmission, ensuring versatility in detecting flaws in composite materials and adhesive bonds. The system supports a wide range of frequencies, accommodating different testing requirements for various materials and thicknesses.

Equipped with a powerful data processing unit, the OmniScan Bond offers rapid data acquisition and real-time visualization, facilitating immediate interpretation and decision-making during inspections. It includes comprehensive data storage options, allowing users to save and export detailed inspection reports and raw data for further analysis or archival purposes.

The device is engineered for compatibility with a variety of probes and accessories, enhancing its adaptability to specific inspection needs. Connectivity features such as USB and Ethernet enable seamless integration with other systems and devices, supporting efficient data transfer and remote operation.

Overall, the Olympus OmniScan Bond stands out for its precision, reliability, and user-friendly operation, making it an ideal solution for industries where bond integrity is critical, such as aerospace, automotive, and manufacturing. Its robust performance and advanced features make it a trusted tool for ensuring the safety and quality of structures and components.

Olympus OmniScan Bond F.A.Q.

What is the best way to set up the Olympus OmniScan Bond for a new inspection task?

To set up the Olympus OmniScan Bond for a new inspection, start by selecting the appropriate probe and wedge combination based on the material and geometry of the test object. Calibrate the device using a reference standard similar to the test object. Configure the software settings to match the inspection requirements, such as frequency, gain, and scan speed. Finally, perform a test scan to ensure the setup produces reliable data.

How can I troubleshoot connectivity issues with the OmniScan Bond unit?

If you encounter connectivity issues with the OmniScan Bond unit, first check all cable connections to ensure they are secure. Verify that the device drivers and firmware are up-to-date. Restart both the OmniScan unit and the connected computer. If the problem persists, consult the user manual for specific troubleshooting steps or contact Olympus technical support for assistance.

How frequently should I perform maintenance on the OmniScan Bond?

Regular maintenance of the OmniScan Bond should be performed according to the manufacturer's guidelines, typically every six to twelve months. This includes checking for software updates, inspecting cables and connectors for wear, cleaning the unit, and verifying the calibration with a reference standard. Regular maintenance ensures reliable operation and longevity of the device.

What should I do if the OmniScan Bond displays inconsistent data readings?

Inconsistent data readings can be caused by several factors. First, ensure that the probe and wedge are properly attached and that the surface being inspected is clean and smooth. Recalibrate the device using a known reference standard. Check all connections for any signs of damage or wear. If the issue persists, consider contacting Olympus support for further diagnostics.

Can the OmniScan Bond be used for composite material inspections?

Yes, the OmniScan Bond is capable of inspecting composite materials. When setting up for composites, it is important to configure the device for the specific properties of the material, such as its density and thickness. Using the correct probe and wedge for composites is crucial to obtaining accurate results.

How do I update the software on the OmniScan Bond?

To update the software on the OmniScan Bond, first check the Olympus website for the latest software version. Download the update file and transfer it to a USB drive. Insert the USB drive into the OmniScan Bond's USB port, then navigate to the software update section in the device menu to initiate the update process. Follow the on-screen instructions to complete the update.

What are the key features of the Olympus OmniScan Bond?

The Olympus OmniScan Bond features advanced phased array capabilities, high-resolution imaging, and user-friendly software interfaces. It supports a range of ultrasonic inspection techniques and offers comprehensive data analysis tools. The unit is portable, allowing for easy on-site inspections, and it has a rugged design suitable for various industrial environments.

How do I ensure accurate calibration of the OmniScan Bond?

To ensure accurate calibration of the OmniScan Bond, use a calibration block that matches the material and thickness of the test object. Follow the calibration procedure outlined in the user manual, which typically involves adjusting the time base, velocity, and gain settings. Perform regular calibrations before each inspection session to maintain accuracy.

What steps should be taken if the OmniScan Bond's display screen is not responding?

If the display screen is not responding, first try restarting the device. Ensure that the battery is fully charged or that the unit is connected to a power source. Check for any visible damage to the screen. If the problem continues, perform a factory reset as per the manual instructions or contact Olympus support for further assistance.

Is it possible to export inspection data from the OmniScan Bond for further analysis?

Yes, inspection data from the OmniScan Bond can be exported for further analysis. The device allows data export in various formats, including CSV and PDF, which can be transferred via USB or network connections. This enables further analysis using specialized software or sharing with other team members.